1. It is suitable for dispensing, bonding and thermosetting the FPC + IC and cover of the fingerprint module.
2. Suitable product size: fingerprint module bonding area Max: 20x15mm (FPC length less than 30mm); Cover 4-6 inches, fit target visual area Max: 25x15mm.
1. High precision dispensing and alignment mounting system, using mature CCD alignment system and high-precision XY θ The shaft alignment system assists the fitting to ensure high precision;
2. Both FPC + IC and cover are automatically loaded. Cover is automatically dispensed at the dispensing station and automatically aligned at the mounting station. The mounting is accurately positioned by a CCD image technology, and the thermosetting is completed by heating up and down;
(Note: for IC feeding, CCD is installed for auxiliary alignment feeding, and IC special profiling material tray is used alternately for left and right plates)
3. Equipped with intelligent control system, with Chinese operation interface and user password protection function;
4. The main accessories are imported from Japan, effectively ensuring the stability of the equipment;
5. The parameters are input and saved by the touch screen to facilitate debugging. The equipment has sound and light alarm function;
6. The whole equipment adopts high rigid structure to improve the overall stability of the equipment;
7. The image photographing system uses mature professional light source to irradiate the pixel points of the module, which can reduce the positioning and fitting error.
